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2309NZ-1HDCG8 Vipimo vya teknolojia
2309NZ-1HDCG8 datasheet pdf and Clock/Timing - Clock Buffers, Drivers product details from Integrated Device Technology (IDT) stock available at Bonchip
Sifa ya Bidhaa | Thamani ya Sifa |
---|---|
Category | Mizunguko Ilounganishi (ICs) / Makaratasi ya Saa & Madereva |
Manufacturer | Integrated Device Technology (IDT) |
Factory Lead Time | 3 Weeks |
Factory Lead Time | 9 Weeks |
Mount | Surface Mount |
Number of Pins | 16 |
Published | 2009 |
Pbfree Code | yes |
Moisture Sensitivity Level (MSL) | 3 |
Max Operating Temperature | 70°C |
Subcategory | Clock Drivers |
Terminal Form | GULL WING |
Number of Functions | 1 |
[email protected] Reflow Temperature-Max (s) | 30 |
Number of Outputs | 9 |
Operating Supply Voltage | 3.3V |
Number of Circuits | 1 |
Min Supply Voltage | 3V |
Power Dissipation | 700mW |
Frequency (Max) | 133.33MHz |
Logic IC Type | PLL BASED CLOCK DRIVER |
Same Edge Skew-Max (tskwd) | 0.25 ns |
Width | 3.9mm |
RoHS Status | RoHS Compliant |
Sifa ya Bidhaa | Thamani ya Sifa |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Pbfree Code | yes |
Contact Plating | Tin |
Package / Case | SOIC |
Packaging | Tape & Reel |
JESD-609 Code | e3 |
Part Status | Active |
Number of Terminations | 16 |
Min Operating Temperature | 0°C |
Terminal Position | DUAL |
Peak Reflow Temperature (Cel) | 260 |
Supply Voltage | 3.3V |
Pin Count | 16 |
Qualification Status | Not Qualified |
Temperature Grade | COMMERCIAL |
Max Supply Voltage | 3.6V |
Power Dissipation-Max | 700mW |
Propagation Delay | 8.7 ns |
Input | LVTTL |
Max I(ol) | 0.008 A |
Length | 9.9mm |
Thickness | 1.5mm |
Lead Free | Lead Free |
2309NZ-1HDCG8 Nyaraka
Pakua hifadhidata na nyaraka za mtengenezaji kwa 2309NZ-1HDCG8
-
Laha za data
Wengine ni pamoja na "2309N" sehemu
Sehemu zifuatazo ni pamoja na '2309N'
Sehemu # | Mtengenezaji | Kategoria | Upatikanaji |
---|---|---|---|
2309NZ-1HDCG | IDT (Integrated Device Technology) | Saa/Kutimiza - Vipelekeshaji vya Saa, Madereva | 2786 |
2309NZ-1HDCG | Integrated Device Technology (IDT) | Makaratasi ya Saa & Madereva | |
2309NZ-1HDCG | Renesas Electronics America Inc. | Makaratasi ya Saa & Madereva | |
2309NZ-1HDCG8 | IDT (Integrated Device Technology) | Saa/Kutimiza - Vipelekeshaji vya Saa, Madereva | 2503 |
2309NZ-1HDCG8 | Renesas Electronics America Inc. | Makaratasi ya Saa & Madereva | |
2309NZ-1HDCGI | IDT (Integrated Device Technology) | Saa/Kutimiza - Vipelekeshaji vya Saa, Madereva | 449 |
2309NZ-1HDCGI | Renesas Electronics America Inc. | Makaratasi ya Saa & Madereva | |
2309NZ-1HDCGI | Integrated Device Technology (IDT) | Makaratasi ya Saa & Madereva | |
2309NZ-1HDCGI8 | IDT (Integrated Device Technology) | Saa/Kutimiza - Vipelekeshaji vya Saa, Madereva | 2593 |
2309NZ-1HDCGI8 | Renesas Electronics America Inc. | Makaratasi ya Saa & Madereva |
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2309NZ-1HDCG8 watengenezaji chapa: Integrated Device Technology (IDT) , Bonchip hisa, 2309NZ-1HDCG8 bei ya kumbukumbu. 2309NZ-1HDCG8 vigezo, 2309NZ-1HDCG8 Datasheet PDF na pini mchoro maelezo download.Unaweza kutumia 2309NZ-1HDCG8 Viunganishi Vinavyozimika, Laha ya Tarehe ya DSP, pata 2309NZ-1HDCG8 mchoro wa pini na mchoro wa mzunguko na njia ya matumizi ya kazi, 2309NZ-1HDCG8 elektroniki tutorials.Unaweza kupakua kutoka Bonchip.
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Barua pepe : [email protected]
Anwani : D1 6th floor,Lehui Center,Jihua Road 489 Longgang District, Shenzhen-518129, China
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